The Tech Blog Writer Podcast - Inspired Tech Startup Stories & Interviews With Tech Leaders, Entrepreneurs And Innovators

  What happens when the limits of traditional chip design collide with the relentless demand for AI and high-performance computing? In today’s episode, I sit down with Abhijeet Chakraborty from Synopsys to explore how multi-die chip architectures are redefining the future of semiconductors. With Moore’s Law slowing and the complexity of computing workloads skyrocketing, the industry is turning to multi-die solutions to push the boundaries of performance, scalability, and efficiency. Synopsys is at the heart of this transformation, powering more than 95% of the world’s advanced chip designs. As AI, IoT, and next-gen computing drive an insatiable need for faster, more efficient processors, the semiconductor industry is undergoing a radical shift. By 2035, the multi-die chip market is expected to reach $411 billion, with at least 50% of new HPC chip designs set to be multi-die or 3D by the end of 2025. Abhijeet walks us through the breakthroughs in Universal Chiplet Interconnect Express (UCIe), the